Application

The development trend in new materials is towards greater functionality, performance, and sustainability. 
The new area will include advanced composite nanomaterials, smart materials, biomaterials, materials with improved mechanical, electrical, and thermal properties are in demand for advanced technologies, 3D printing material and so on.

Soft bake in semiconductor fabrication belongs to the category of thermal processes known as Post-Apply Bake (PAB) or Pre-exposure Bake. For soft bake, convection ovens or hot plates are commonly used. Convection ovens provide a uniform heating environment for the wafer to evaporate solvents from the photoresist layer.
Hot plates offer precise temperature control and direct heating to ensure solvent removal and adhesion enhancement.

Curing Adhesives: After LED dispensing, the optoelectronic oven uses oven to rapidly cure adhesives, ensuring quick fixation of the adhesive.
Temperature Control: The optoelectronic oven can adjust temperature and time based on different types of adhesives and process requirements to ensure optimal curing effects.