Application
Electronics
2024-06-24 19:37:16
Optoelectronic Oven
The optoelectronic oven plays a crucial role LED dispensing and die bonding.
Curing Adhesives: After LED dispensing, the optoelectronic oven uses oven to rapidly cure adhesives, ensuring quick fixation of the adhesive.
Temperature Control: The optoelectronic oven can adjust temperature and time based on different types of adhesives and process requirements to ensure optimal curing effects.
Die Bonding
Die bonding involves securely bonding LED chips to substrates.
Heating and Curing: By controlling temperature profiles and employing a constant temperature system, the optoelectronic oven uniformly heats the adhesive, facilitating rapid curing to ensure high-quality bonding between the LED chip and substrate.
Bubble Elimination: Proper temperature and time settings in the die bonding process help eliminate bubbles trapped in the adhesive layer, enhancing the quality and reliability of LED components.
Key technical factors for optoelectronic oven are temperature uniformity and stepped temperature rise, this may increase the LED quality especially for mass production.
Storage of Moisture-Sensitive Components: LED chips, powers, substrates, ready LED lights.
Related Products:
■ Stand Type Vacuum Oven
■ Multichamber Curing Oven
■ Truck-in Industrial Oven
■ Vertical Batch Oven
■ Conveyor Drying Oven
■ ESD Safe Drying Cabinets
Electronic such as digital consumer products, electronic appliances production have turned to mass production. We provide customization automatic baking solutions for electronic product assembly production line for component curing, PCB Soldering, pre-heat treatment, drying after Assembly and so on.
Related Products:
■ Multi-chamber Curing Oven
■ Truck-in Industrial Oven
■ Vertical Batch Oven
■ Conveyor Drying Oven
■ ESD Safe Drying Cabinets
■ Customized Automatic Machine
SMD Components
Moisture sensitive SMDs which have been exposed only to ambient conditions of ≤60% RH for any length of time may be adequately dried by baking according to Table 2 prior to reflow or Table 3 for drying prior to dry pack.
Truck-in Industrial Oven
Vertical Batch Oven
If the customer cannot mount the SMDs within the specified time limit, or factory ambient conditions exceed the specified maximum temperature and/or humidity level, then the customer can abate moisture absorption by following any of the safe storage methods to maintain the floor life:
Dry Atmosphere Cabinet Nitrogen or dry air-purged storage cabinets with low humidity maintained at 25 ± 5°C and capable of recovering to the required humidity within one hour from opening and/or closing cabinet door/s.
Dry Cabinet at 10% RH SMDs not sealed in a MBB may be placed in a dry atmosphere cabinet maintained at ≤10% RH up to a maximum time specified in J-STD-033B.1. If the time limit is exceeded, bake is required to restore the floor life.
Dry Cabinet at 5% RH SMDs not sealed in a MBB may be placed in a dry atmosphere cabinet maintained at ≤5% RH for an unlimited shelf life equivalent to storage in a MBB.