Application
Semiconductor
2024-06-24 19:37:16
Wafer Treatment BCB Curing/ Polyimide PI Curing/Soft Bake And Hard Bake
Soft bake in semiconductor fabrication belongs to the category of thermal processes known as Post-Apply Bake (PAB) or Pre-exposure Bake. For soft bake, convection ovens or hot plates are commonly used. Convection ovens provide a uniform heating environment for the wafer to evaporate solvents from the photoresist layer.
Hot plates offer precise temperature control and direct heating to ensure solvent removal and adhesion enhancement.
Hard bake in semiconductor fabrication is also considered a thermal process falling under the category of Post-Develop Bake (PDB) or Post-Bake. Hard bake processes typically involve using dedicated hot plates or specialized convection ovens with controlled environments that can reach higher temperatures than those used for soft bake.
Related Products:
■ High Temperature Vacuum Drying Oven
■ 360℃-600℃ Inert gas Oven
Parts Drying
In semiconductor fabrication, there are many precision machined metal parts, instruments and quartz fixture and containers shall be cleaned and dry. The air in the drying oven is continuously circulated making the ovens significantly efficient. All air passes through a class 100 air filter so only clean, hot air is directed at the work piece.
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■ Vertical class 100 clean room oven
IC Packaging
In the IC packaging process, die bonding and underfill are two crucial steps used to ensure the firmness and reliability of integrated circuit (IC) components. Thermal processing is also core steps that ensure the final quality of electronics.
Curing Ovens: Utilize curing ovens with precise temperature control to ensure uniform curing of the adhesive.
Curing Chambers: For large-scale production, curing chambers equipped with controlled temperature and humidity settings can be employed for batch curing of adhesives.
Vacuum Oven: The application of vacuum ovens in IC packaging involves several key aspects: playing a critical role in ensuring the quality, reliability, and performance of IC packages for various stages of the packaging process.
De-aeration: Vacuum ovens are used to remove air and gas bubbles from the encapsulation material, ensuring that the IC package is free of voids or defects that could affect its performance.
Drying: Vacuum ovens can be utilized to dry the encapsulation material before the final sealing process. Removing moisture is crucial to prevent issues like delamination or poor adhesion.
Curing: Some encapsulation materials require a curing process under controlled conditions. Vacuum ovens provide an environment where curing can occur efficiently and uniformly.
Preventing Oxidation: By creating a vacuum environment, oxygen levels are reduced, which helps prevent oxidation of sensitive components during the packaging process.
Enhancing Adhesion: Vacuum ovens can improve the adhesion properties of encapsulation materials by removing impurities, moisture, and air pockets that could hinder bonding.
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■ Inert gas Oven
■ Stand Type Vacuum Oven
■ Multichamber Curing Oven
■ Vertical batch oven
■ Conveyor drying oven
Clean Storage
Sustainless steel nitrogen cabinet are equipped can constantly maintain the ultra-low humidity to minimum 1%RH to meet IPC (J-STD-033C) demands, and are ideal for the moisture-proof and anti-oxidation storage of integrated circuits and silicon wafers, optical components, and precise instruments. All cabinet is made of stainless steel, especially suitable for clean rooms.
For those products that need to be temporarily stored during the production process of electronic devices, optoelectronic devices, semiconductor chips and other devices to prevent oxidation. Vacuum storage cabinet will be good choice.
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■ Sustainless Nitrogen Cabinet
■ Vacuum Storage Cabinet
Adhesion Promotion /Organics Removal
In semiconductor processing, plasma cleaning is commonly used to prepare a wafer surface prior to wire bonding. Removing contamination (flux) strengthens the bond adhesion, which helps extend device reliability and longevity.
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■ Vacuum Plasma Cleaning Machine