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PI (polyimide) baking process is more and more widely used in many industries. PI material has excellent high temperature resistance, low temperature resistance, corrosion resistance and other characteristics, has become an important engineering materials.The complexity of the PI baking process has also increased, and the requirements for the baking equipment are also more stringent.The PI baking process is commonly used in semiconductor manufacturing, COB packaging, medical and health care, flexible circuit board printing, Precision mould annealing and other industries. In these industries, oxygen-free oven is widely used in PI, BCB, LCP curing baking, photoresist curing, electronic ceramic materials drying special process requirements.

Oxygen-free oven is a special baking equipment that can maintain a low oxygen environment during the baking process to prevent materials from being oxidised. This type of oven is mainly used for baking materials that react easily with oxygen at high temperatures, such as PI materials. Oxygen-free ovens offer many advantages, such as improving product quality, protecting materials from oxidation, and increasing production efficiency. In the PI baking industry, oxygen-free ovens are widely used in various processes, such as curing, drying, testing, aging, and annealing.

1. to prevent oxidation: PI material is easy to oxidize at high temperature, which leads to the deterioration of material properties. The use of oxygen-free oven can effectively prevent the occurrence of oxidation. Oxygen-free oven to control the internal atmosphere, to exclude oxygen, thereby protecting the PI material from the effects of oxidation, to ensure the stability and reliability of its performance.

 2. improve the baking effect: oxygen-free oven has good temperature control and uniform temperature distribution, using a one-way horizontal air transport, strong pressure in the duct on both sides of the air supply, air ducts on both sides of the use of high-density perforated wind board, precise control of the angle of the deflector plate, to ensure that the temperature uniformity of the box. This enables the PI material to be uniformly heated during the baking process, thus improving the baking effect. The temperature uniformity helps to reduce the stress and deformation inside the PI material, ensuring its shape stability and dimensional accuracy.

 3. reduce the risk of contamination: oxygen-free oven can effectively reduce the entry of impurities and contaminants. Oxygen-free oven Internal stainless steel structure, the box is continuously filled with nitrogen, so that the oven chamber is in a low-oxygen, clean state. In the preparation process of PI materials, some impurities and contaminants will have a negative impact on the material properties. Through the use of oxygen-free oven, can reduce the pollutants in the outside air into the baking environment, thereby reducing the risk of contamination.

 4. improve productivity: oxygen-free ovens have the ability to quickly heat up and cool down, thus improving productivity. Compared to traditional baking methods, oxygen-free ovens are able to heat the PI material to the desired temperature and return it to room temperature more quickly. This reduces cycle time and increases productivity.