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Semiconductor Nitrogen Oven Type and Process
2024-06-23 22:04:36
In the semiconductor manufacturing industry, semiconductor nitrogen oven is mainly used for baking, curing, annealing and other processes, and its design takes into account the special needs of semiconductors, such as precise temperature control, high cleanliness environment and antioxidant protection. According to different process requirements, nitrogen oven has a variety of types, and corresponds to different processes, can be divided into precision nitrogen oven, clean nitrogen oven and high-temperature oxygen-free oven. Precision nitrogen oven is suitable for a variety of drying or curing processes, such as RGBT baking, PCB board antioxidant baking, photoresist curing and so on. Clean nitrogen oven is commonly used in the process of higher cleanliness requirements, such as photoresist pre-bake and solid film oven. High-temperature oxygen-free oven is particularly suitable for curing processes that require an oxygen-free environment.
I. Types of Semiconductor Nitrogen Oven
(1). Precision nitrogen oven: suitable for a variety of drying or curing processes, such as: RGBT baking, PCB board anti-oxidation baking, photoresist curing, silicon wafer high temperature annealing. The temperature control of the oven is precise and can meet the fine requirements of different materials on baking temperature.
(2). Clean nitrogen oven: clean nitrogen oven is usually used for the higher cleanliness requirements of the process, such as: photoresist pre-bake (soft bake), hard film oven (hard bake) and so on. This oven in the baking process to maintain a high degree of cleanliness, to avoid the impact of impurities on semiconductor materials.
(3). High-temperature oxygen-free oven: mainly used for baking processes that need to be carried out in an oxygen-free or low-oxygen environment, such as: BCB / PI / CPI / LCP / PBO and other curing processes. High-temperature oxygen-free oven can ensure that the material is not affected by oxidation during the baking process, and improve the quality and stability of the product.
(4). HMDS oven: there are HMDS oven is mainly used to change the substrate from hydrophilic to hydrophobic, enhance the adhesion of the substrate, suitable for MEMS, filtering, amplification, power and other devices manufacturing.
Second, the process of semiconductor nitrogen oven
The nitrogen oven process is set up primarily to meet the manufacturing needs of semiconductor products. During the manufacturing process, the baking process is usually used to remove moisture and impurities, as well as to perform curing or annealing of materials.
1. Baking of the device before encapsulation: In this step, the oven will be heated to the required temperature, usually between 200 and 400°C. The baking is done to remove moisture and other impurities from the inside of the device and the surface of the material. Through baking, moisture and other impurities inside the device and on the surface of the material can be removed in preparation for the next component manufacturing. This step is key to ensuring the quality and reliability of the components.
2. Component surface cleaning and degassing: After the initial baking is completed, the components will be placed in the oven, at which time nitrogen will be introduced into the equipment to replace the air in the equipment. The inert nature of nitrogen effectively prevents oxygen and other gases from reacting with the component material, thereby protecting it from oxidation. In addition, this process helps to remove impurities and gases adhering to the surface of the component, further cleaning the surface of the component.
3. Material protection and antioxidant treatment: After the component surface is cleaned and degassed, the oven will further increase the temperature, usually to between 400 and 600°C. At this temperature, nitrogen will continue to protect the component material from oxidation. By controlling the temperature and the flow of nitrogen, precise control of material properties can be achieved to meet the specific needs of semiconductor manufacturing.
According to different process requirements, the nitrogen oven can also carry out other types of baking treatment, such as high temperature annealing in the epitaxial substrate process, encapsulation process substrate baking moisture removal, silver adhesive curing. These processes require precise control of baking temperature and time to ensure the quality and performance of semiconductor products.
Semiconductor nitrogen oven in the semiconductor manufacturing process, different types of nitrogen oven can meet different process needs, there are different application scenarios and process requirements, through precise control of temperature, atmosphere and cleanliness and other parameters, you can achieve high quality manufacturing of semiconductor components. Thus ensuring the quality and performance of semiconductor products.