Products

GMS silicone rubber vulcanization oven is also known as silicone vulcanization oven, silicone second vulcanization oven, silicone post vulcanization oven. Secondary vulcanization is also called post-vulcanization. After the second vulcanization of silicone products pull up strength, resilience, hardness, swelling degree, density, thermal stability than a vulcanization has a greater improvement.

As the silicone products will produce more "pungent" gas when vulcanized at about 150℃, the electric heating vulcanization oven is equipped with a forced extractor fan on the top, and the extracted gas is discharged to the outside of the workshop through the external piping.

The electric heating silicone secondary vulcanization oven can control the temperature intelligently and set different temperature according to different silicone products, meanwhile, the silicone secondary vulcanization oven has multiple protection functions, so the users can be assured to choose it in the process of use.

Explosion-proof ovens are essential for industries handling flammable materials and ensuring safety in hazardous environments. These ovens are designed to house volatile atmospheres and handle hazardous materials. They include safety features recommended in NFPA Bulletin 86 as standard such as incorporating safety features like pressure relief valves and flame-proof electrical components, high-mass sheathed heaters and explosion vents, ensuring safe handling of flammable materials.

These ovens are crucial for industries such as aerospace, chemical, paint, and basic materials, providing a safe environment for handling and expelling flammable vapors.

This tunnel oven features a dual-layer design with integrated fixture loading/unloading and automated return functionality. At the infeed section, the system synchronizes with upstream automation equipment to precisely load products onto fixtures. These fixtures then transport products through the heating tunnel for controlled baking.

The discharge end incorporates downstream automation for product unloading, after which fixtures are automatically transferred to the lower return conveyor. The fixtures efficiently cycle back to the tunnel entrance for reloading, completing a continuous production loop.

By seamlessly connecting baking processes with automated material handling, this system achieves fully automated production line integration, delivering significant efficiency improvements of 30-50% compared to conventional systems.

The automatic Scan-Code Oven is a multifunctional automated baking device. It features automatic door opening and closing, enabling close collaboration with AGVs or wafer handlers for automated material handling, while also supporting manual loading and unloading. With four independent chambers, each equipped with a touchscreen for customized parameter settings, the oven can meet diverse production needs. A scanning chamber is integrated to bind materials during loading and unloading, automatically retrieving baking recipes to ensure process accuracy. Moreover, it can be connected to a host computer for local data storage and processing, and communicate with the MES system to achieve intelligent production control. This makes it widely applicable in semiconductor and other fields, enhancing production efficiency and product quality.

Vacuum storage cabinet is used to store products that need to avoid oxidation during product storage. It can replace vacuum package as well. This vacuum storage cabinet consists of 6 or 9 independent chambers and control panel, the general layout is shown in the following figure. The vacuum chambers are independently controlled and share one set of vacuum system. 

Mainly for molding and curing, precision baking like drying, shaping and processing of IC(DB/WB), FPD, electronic ceramic materials and so on.

• Available for 2/3/4/6 chamber combination (standalone control for each chamber)
• Different types of opening door method to adaptto AGV robot
• Saving the installation space
• Temperature range: RT+30-300°C

Product Description

Clean ovens are used extensively in heat treatment or drying of semiconductor wafers, liquid crystals, disks and other components and devices requiring clean air conditions.

• Class 100
• 350L large capacity
• temperature 260℃

Small baking equipment, the maximum temperature of 250 ℃, using vacuum and nitrogen function combined to create oxygen-free, single bake a piece of wafer, suitable for small batch applications. Typical applications for this system include SOG annealing, copper annealing, aluminum annealing, low-k dielectric annealing and photoresist baking, drying and so on.

Vacuum storage cabinet is used to store products that need to avoid oxidation during product storage. It can replace vacuum package as well. This vacuum storage cabinet consists of 6 or 9 independent chambers and control panel, the general layout is shown in the following figure. The vacuum chambers are independently controlled and share one set of vacuum system. 

Suitable for curing semiconductor wafers (photoresist PI, PBO, BCB curing), glass substrate baking, and high-precision annealing treatment, etc. 

Max. working temperature: 360℃, 600℃.
Oxygen concentration lower than 20 ppm.

Vacuum ovens are ideal for removing residual water, solvents or other volatile compounds from temperature-sensitive products. The principle of operation, essentially, is to remove unwanted molecules by lowering the pressure in the oven (creating a vacuum). When the oven pressure reaches the desired vapor pressure of the contaminants, these contaminant molecules evaporate, turn to vapor, and are removed from all areas of the product. This drying is accomplished without the use of excessive heat. This makes vacuum drying suitable for materials that become damaged or are changed if exposed to high temperatures. Vacuum drying also minimizes the risk of scaling and the formation of oxidation residues. Vacuum high temperature ovens are typically used for products that are not heat resistant and are temperature sensitive. This type of oven is widely used in semiconductor, MEMS, electronic area.

GMS inert gas ovens are designed for durability and performance. Inert gas ovens are ideal for industrial oven applications that involve processing materials in a controlled atmosphere environment, including moisture drying, wafer drying, epoxy curing, and aging of electronic components and devices. The GMS inert gas oven utilizes a high-volume horizontal air recirculation system which maximizes temperature uniformity and performance.

Ensure effective heating while protecting samples from oxidation with GMS’s selection of Inert Gas Ovens. Confidently work on temperature tests and heat treatments in a non-oxidizing environment with inert gas ovens that supply controllable and non-flammable N2 within the chamber.